A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...
Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI switches, and high-quality passives on a single wafer—opening a path to ...
Monolithic 3D integrated circuits represent a transformative approach to semiconductor design, where successive layers of devices are fabricated directly on top of one another using low-temperature ...
Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...
A new technical paper titled “Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects” was published by researchers at the Technical University of ...
A flexible monolithic 3D-integrated tactile sensing system, inspired by the tactile perception mechanism of human skin, was developed based on a holey MXene paste. Large-scale device fabrication was ...
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