Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator in laser-based micromachining solutions, today unveiled its Ultrus TM laser processing system, designed ...

United Microelectronics Corporation (UMC), the giant Taiwan-headquartered chip foundry, has signed a licensing deal to ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

With copper interconnects facing limitations amid growing AI data workloads, silicon photonics - using light to transmit data - is developing rapidly to support the ultra-high bandwidth, low latency, ...

Oct 29, 2024, Munich – 29 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

Sunwafe says it has formally applied to reserve land in Asturias, Spain, for a 20 GW silicon wafer and ingot factory backed ...