A new 3D glass printing process developed at Karlsruhe Institute of Technology (KIT), Germany, produces nanometer-fine quartz glass structures that can be printed directly onto semiconductor chips. A ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

(Nanowerk News) A new process developed at the Karlsruhe Institute of Technology (KIT) enables printing of nanometer-scale quartz glass structures directly onto semiconductor chips. A hybrid ...

Tolerating heat and helping to reduce it are both attributes that sintering offers as an alternative to soldering in power electronics applications. Doing more with less and, of course, packing more ...

A new techno-economic analysis shows that the energy intensive ceramic industry would gain both financial and environmental benefits if it moved to free the cold sintering process from languishing in ...

A method has been developed to extend the lifespan of equipment used in the etching process for semiconductor manufacturing. The etching process is a step in making semiconductors where specific parts ...

The Temporal Fusion Transformer model provides near-real-time insights into sintering temperatures, addressing critical ...