A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI switches, and high-quality passives on a single wafer—opening a path to ...

Monolithic 3D integrated circuits represent a transformative approach to semiconductor design, where successive layers of devices are fabricated directly on top of one another using low-temperature ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

A flexible monolithic 3D-integrated tactile sensing system, inspired by the tactile perception mechanism of human skin, was developed based on a holey MXene paste. Large-scale device fabrication was ...

Optoelectronic devices, such as infrared sensors and LED displays, are the backbone of modern technologies, from medical imaging to smartphone screens. Traditionally, integrating these devices with ...